The visual test are based on microscopically observation; for this time several kinds of remarks can to be reported.
- Substrate / Ceramic : planarity, lamination.
- Cable and connector NAIS : cable quality, soldering, alignment, gluing.
- Cleanness : Circuit, APV, Bond pad.
-
Components :
placement, damage.
- Soldering : aspect, quantity, residue, micro-droplets.
- Bonding : placement, height, break, lift-off.
- Circuit Via : minimum width, damages.
A
hybrid is considered as bad for the visual inspection if there is “ –1 ” on one of the criteria below, or it
has more as 15 micro-droplets or at least it has three missing or broken wire
bonds per APV.
***** CONSORTIUM 1
: BATCH 1*****
|
ORDERED |
RECEIVED |
TOTAL TESTED |
|||
|
100 |
96 |
13 |
|||
|
|
|
|
|
REJECTED |
ACCEPTED |
|
|
|
SUBSTRATE
and CERAMIC |
PLANARITY |
0 |
13 |
|
LAMINATION |
1 |
12 |
|||
|
CABLE AND CONNECTOR NAIS |
CABLE QUALITY |
0 |
13 |
||
|
SOLDERING |
1 |
12 |
|||
|
ALIGNMENT |
0 |
13 |
|||
|
APV |
GLUING |
0 |
13 |
||
|
CLEANNESS |
CIRCUIT |
1 |
12 |
||
|
APV |
0 |
13 |
|||
|
BOND PAD |
2 |
11 |
|||
|
COMPONENTS |
PLACEMENT |
0 |
13 |
||
|
DAMAGE |
0 |
13 |
|||
|
SOLDERING |
ASPECT |
0 |
13 |
||
|
QUANTITY |
0 |
13 |
|||
|
RISIDUES |
0 |
13 |
|||
|
MICRO-DROPLETS |
4 |
9 |
|||
|
BONDING |
PLACEMENT |
1 |
12 |
||
|
HEIGHT |
2 |
11 |
|||
|
BREAK |
2 |
11 |
|||
|
LIFT-OFF |
1 |
12 |
|||
|
CIRCUIT VIA |
MINIMUM WIDTH |
0 |
13 |
||
|
DAMAGES |
0 |
13 |
|||
|
|
|
|
|
|
|
|
|
|
|
ALL TESTS MERGED |
7 |
6 |
***** CONSORTIUM 1 : BATCH 2 *****
|
ORDERED |
RECEIVED |
TOTAL TESTED |
|||
|
100 |
96 |
96 |
|||
|
|
|
|
|
REJECTED |
ACCEPTED |
|
|
|
SUBSTRATE
and CERAMIC |
PLANARITY |
4 |
92 |
|
LAMINATION |
96 |
0 |
|||
|
CABLE AND CONNECTOR NAIS |
CABLE QUALITY |
0 |
96 |
||
|
SOLDERING |
3 |
93 |
|||
|
ALIGNMENT |
1 |
95 |
|||
|
APV |
GLUING |
0 |
96 |
||
|
CLEANNESS |
CIRCUIT |
0 |
96 |
||
|
APV |
0 |
96 |
|||
|
BOND PAD |
0 |
96 |
|||
|
COMPONENTS |
PLACEMENT |
3 |
93 |
||
|
DAMAGE |
0 |
96 |
|||
|
SOLDERING |
ASPECT |
0 |
96 |
||
|
QUANTITY |
0 |
96 |
|||
|
RISIDUES |
0 |
96 |
|||
|
MICRO-DROPLETS |
23 |
73 |
|||
|
BONDING |
PLACEMENT |
0 |
96 |
||
|
HEIGHT |
0 |
96 |
|||
|
BREAK |
2 |
94 |
|||
|
LIFT-OFF |
3 |
93 |
|||
|
CIRCUIT VIA |
MINIMUM WIDTH |
0 |
96 |
||
|
DAMAGES |
0 |
96 |
|||
|
|
|
|
|
|
|
|
|
|
|
ALL TESTS MERGED |
30 |
66 |
***** CONSORTIUM 2
: BATCH 3 *****
|
ORDERED |
RECEIVED |
TOTAL TESTED |
|||
|
50 |
48 |
40 |
|||
|
|
|
|
|
REJECTED |
ACCEPTED |
|
|
|
SUBSTRATE
and CERAMIC |
PLANARITY |
10 |
30 |
|
LAMINATION |
0 |
40 |
|||
|
CABLE AND CONNECTOR NAIS |
CABLE QUALITY |
1 |
39 |
||
|
SOLDERING |
0 |
40 |
|||
|
ALIGNMENT |
0 |
40 |
|||
|
APV |
GLUING |
1 |
39 |
||
|
CLEANNESS |
CIRCUIT |
11 |
29 |
||
|
APV |
5 |
35 |
|||
|
BOND PAD |
3 |
37 |
|||
|
COMPONENTS |
PLACEMENT |
1 |
39 |
||
|
DAMAGE |
0 |
40 |
|||
|
SOLDERING |
ASPECT |
8 |
32 |
||
|
QUANTITY |
1 |
39 |
|||
|
RISIDUES |
11 |
29 |
|||
|
MICRO-DROPLETS |
1 |
39 |
|||
|
BONDING |
PLACEMENT |
1 |
39 |
||
|
HEIGHT |
12 |
28 |
|||
|
BREAK |
4 |
36 |
|||
|
LIFT-OFF |
5 |
35 |
|||
|
CIRCUIT VIA |
MINIMUM WIDTH |
0 |
40 |
||
|
DAMAGES |
0 |
40 |
|||
|
|
|
|
|
|
|
|
|
|
|
ALL TESTS MERGED |
13 |
27 |
***** CONSORTIUM 1 : BATCH 4.1 *****
|
ORDERED |
RECEIVED |
TOTAL TESTED |
|||
|
80 |
76 |
76 |
|||
|
|
|
|
|
REJECTED |
ACCEPTED |
|
|
|
SUBSTRATE
and CERAMIC |
PLANARITY |
0 |
76 |
|
LAMINATION |
0 |
76 |
|||
|
CABLE AND CONNECTOR NAIS |
CABLE QUALITY |
0 |
76 |
||
|
SOLDERING |
0 |
76 |
|||
|
ALIGNMENT |
0 |
76 |
|||
|
APV |
GLUING |
0 |
76 |
||
|
CLEANNESS |
CIRCUIT |
0 |
76 |
||
|
APV |
0 |
76 |
|||
|
BOND PAD |
1 |
75 |
|||
|
COMPONENTS |
PLACEMENT |
0 |
76 |
||
|
DAMAGE |
0 |
76 |
|||
|
SOLDERING |
ASPECT |
0 |
76 |
||
|
QUANTITY |
1 |
75 |
|||
|
RISIDUES |
0 |
76 |
|||
|
MICRO-DROPLETS |
14 |
62 |
|||
|
BONDING |
PLACEMENT |
0 |
76 |
||
|
HEIGHT |
0 |
76 |
|||
|
BREAK |
0 |
76 |
|||
|
LIFT-OFF |
0 |
76 |
|||
|
CIRCUIT VIA |
MINIMUM WIDTH |
0 |
76 |
||
|
DAMAGES |
0 |
76 |
|||
|
|
|
|
|
|
|
|
|
|
|
ALL TESTS MERGED |
14 |
62 |
***** CONSORTIUM 1 : BATCH 4.2 *****
|
ORDERED |
RECEIVED |
TOTAL TESTED |
|||
|
20 |
19 |
19 |
|||
|
|
|
|
|
REJECTED |
ACCEPTED |
|
|
|
SUBSTRATE
and CERAMIC |
PLANARITY |
0 |
19 |
|
LAMINATION |
0 |
19 |
|||
|
CABLE AND CONNECTOR NAIS |
CABLE QUALITY |
0 |
19 |
||
|
SOLDERING |
0 |
19 |
|||
|
ALIGNMENT |
0 |
19 |
|||
|
APV |
GLUING |
0 |
19 |
||
|
CLEANNESS |
CIRCUIT |
1 |
18 |
||
|
APV |
1 |
18 |
|||
|
BOND PAD |
0 |
19 |
|||
|
COMPONENTS |
PLACEMENT |
2 |
16 |
||
|
DAMAGE |
0 |
19 |
|||
|
SOLDERING |
ASPECT |
1 |
18 |
||
|
QUANTITY |
0 |
19 |
|||
|
RISIDUES |
0 |
19 |
|||
|
MICRO-DROPLETS |
7 |
12 |
|||
|
BONDING |
PLACEMENT |
0 |
19 |
||
|
HEIGHT |
1 |
18 |
|||
|
BREAK |
0 |
19 |
|||
|
LIFT-OFF |
0 |
19 |
|||
|
CIRCUIT VIA |
MINIMUM WIDTH |
0 |
19 |
||
|
DAMAGES |
0 |
19 |
|||
|
|
|
|
|
|
|
|
|
|
|
ALL TESTS MERGED |
10 |
9 |
During the repairing, some defaults have been
appear like a lot of micro-droplets and components displacement
As shown in the following pictures.
30216711300558 30216711300565
***** CONSORTIUM 1 : BATCH 5.1 *****
|
ORDERED |
RECEIVED |
TOTAL TESTED |
|||
|
5 |
5 |
5 |
|||
|
|
|
|
|
REJECTED |
ACCEPTED |
|
|
|
SUBSTRATE
and CERAMIC |
PLANARITY |
0 |
5 |
|
LAMINATION |
0 |
5 |
|||
|
CABLE AND CONNECTOR NAIS |
CABLE QUALITY |
0 |
5 |
||
|
SOLDERING |
0 |
5 |
|||
|
ALIGNMENT |
0 |
5 |
|||
|
APV |
GLUING |
0 |
5 |
||
|
CLEANNESS |
CIRCUIT |
0 |
5 |
||
|
APV |
0 |
5 |
|||
|
BOND PAD |
1 |
4 |
|||
|
COMPONENTS |
PLACEMENT |
0 |
5 |
||
|
DAMAGE |
0 |
5 |
|||
|
SOLDERING |
ASPECT |
0 |
5 |
||
|
QUANTITY |
0 |
5 |
|||
|
RISIDUES |
0 |
5 |
|||
|
MICRO-DROPLETS |
1 |
4 |
|||
|
BONDING |
PLACEMENT |
0 |
5 |
||
|
HEIGHT |
0 |
5 |
|||
|
BREAK |
0 |
5 |
|||
|
LIFT-OFF |
0 |
5 |
|||
|
CIRCUIT VIA |
MINIMUM WIDTH |
0 |
5 |
||
|
DAMAGES |
0 |
5 |
|||
|
|
|
|
|
|
|
|
|
|
|
ALL TESTS MERGED |
2 |
3 |
***** CONSORTIUM 1 : BATCH 5.2 *****
|
ORDERED |
RECEIVED |
TOTAL TESTED |
|||
|
5 |
5 |
5 |
|||
|
|
|
|
|
REJECTED |
ACCEPTED |
|
|
|
SUBSTRATE
and CERAMIC |
PLANARITY |
0 |
5 |
|
LAMINATION |
0 |
5 |
|||
|
CABLE AND CONNECTOR NAIS |
CABLE QUALITY |
0 |
5 |
||
|
SOLDERING |
0 |
5 |
|||
|
ALIGNMENT |
0 |
5 |
|||
|
APV |
GLUING |
0 |
5 |
||
|
CLEANNESS |
CIRCUIT |
0 |
5 |
||
|
APV |
0 |
5 |
|||
|
BOND PAD |
1 |
4 |
|||
|
COMPONENTS |
PLACEMENT |
0 |
5 |
||
|
DAMAGE |
0 |
5 |
|||
|
SOLDERING |
ASPECT |
0 |
5 |
||
|
QUANTITY |
0 |
5 |
|||
|
RISIDUES |
0 |
5 |
|||
|
MICRO-DROPLETS |
3 |
2 |
|||
|
BONDING |
PLACEMENT |
0 |
5 |
||
|
HEIGHT |
0 |
5 |
|||
|
BREAK |
0 |
5 |
|||
|
LIFT-OFF |
0 |
5 |
|||
|
CIRCUIT VIA |
MINIMUM WIDTH |
0 |
5 |
||
|
DAMAGES |
0 |
5 |
|||
|
|
|
|
|
|
|
|
|
|
|
ALL TESTS MERGED |
3 |
2 |
***** CONSORTIUM 1 : BATCH 6.1 *****
|
ORDERED |
RECEIVED |
TOTAL TESTED |
|||
|
5 |
5 |
5 |
|||
|
|
|
|
|
REJECTED |
ACCEPTED |
|
|
|
SUBSTRATE
and CERAMIC |
PLANARITY |
0 |
5 |
|
LAMINATION |
0 |
5 |
|||
|
CABLE AND CONNECTOR NAIS |
CABLE QUALITY |
0 |
5 |
||
|
SOLDERING |
0 |
5 |
|||
|
ALIGNMENT |
0 |
5 |
|||
|
APV |
GLUING |
0 |
5 |
||
|
CLEANNESS |
CIRCUIT |
0 |
5 |
||
|
APV |
0 |
5 |
|||
|
BOND PAD |
0 |
5 |
|||
|
COMPONENTS |
PLACEMENT |
0 |
5 |
||
|
DAMAGE |
0 |
5 |
|||
|
SOLDERING |
ASPECT |
0 |
5 |
||
|
QUANTITY |
0 |
5 |
|||
|
RISIDUES |
0 |
5 |
|||
|
MICRO-DROPLETS |
0 |
5 |
|||
|
BONDING |
PLACEMENT |
0 |
5 |
||
|
HEIGHT |
0 |
5 |
|||
|
BREAK |
0 |
5 |
|||
|
LIFT-OFF |
0 |
5 |
|||
|
CIRCUIT VIA |
MINIMUM WIDTH |
0 |
5 |
||
|
DAMAGES |
0 |
5 |
|||
|
|
|
|
|
|
|
|
|
|
|
ALL TESTS MERGED |
0 |
5 |
***** CONSORTIUM 1 : BATCH 6.2 *****
|
ORDERED |
RECEIVED |
TOTAL TESTED |
|||
|
5 |
5 |
5 |
|||
|
|
|
|
|
REJECTED |
ACCEPTED |
|
|
|
SUBSTRATE
and CERAMIC |
PLANARITY |
0 |
5 |
|
LAMINATION |
0 |
5 |
|||
|
CABLE AND CONNECTOR NAIS |
CABLE QUALITY |
0 |
5 |
||
|
SOLDERING |
0 |
5 |
|||
|
ALIGNMENT |
0 |
5 |
|||
|
APV |
GLUING |
0 |
5 |
||
|
CLEANNESS |
CIRCUIT |
0 |
5 |
||
|
APV |
0 |
5 |
|||
|
BOND PAD |
0 |
5 |
|||
|
COMPONENTS |
PLACEMENT |
0 |
5 |
||
|
DAMAGE |
0 |
5 |
|||
|
SOLDERING |
ASPECT |
0 |
5 |
||
|
QUANTITY |
0 |
5 |
|||
|
RISIDUES |
0 |
5 |
|||
|
MICRO-DROPLETS |
0 |
5 |
|||
|
BONDING |
PLACEMENT |
0 |
5 |
||
|
HEIGHT |
0 |
5 |
|||
|
BREAK |
0 |
5 |
|||
|
LIFT-OFF |
0 |
5 |
|||
|
CIRCUIT VIA |
MINIMUM WIDTH |
0 |
5 |
||
|
DAMAGES |
0 |
5 |
|||
|
|
|
|
|
|
|
|
|
|
|
ALL TESTS MERGED |
0 |
5 |